• Buffer And Water Absorption Standard Rigid Printed Circuit Board PCB Cushion Pad MKCP-PCB-G2
  • Buffer And Water Absorption Standard Rigid Printed Circuit Board PCB Cushion Pad MKCP-PCB-G2
  • Buffer And Water Absorption Standard Rigid Printed Circuit Board PCB Cushion Pad MKCP-PCB-G2
Buffer And Water Absorption Standard Rigid Printed Circuit Board PCB Cushion Pad MKCP-PCB-G2

Buffer And Water Absorption Standard Rigid Printed Circuit Board PCB Cushion Pad MKCP-PCB-G2

Product Details:

Place of Origin: China
Brand Name: MK
Model Number: MKCP-PCB-G2

Payment & Shipping Terms:

Minimum Order Quantity: 10pcs
Price: negotiable
Packaging Details: export package
Delivery Time: 15days after getting the prepayment
Payment Terms: L/C,D/A,D/P,T/T,Western Union
Supply Ability: 10000 pcs per month
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Detail Information

Highlight:

rigid PCB cushion pad

,

water absorption PCB pad

,

standard laminated PCB pad

Product Description

Buffer And Water Absorption Standard Rigid Printed Circuit Board PCB Cushion Pad MKCP-PCB-G2
Rigid PCB cushion pad is specially designed for hot lamination buffering during rigid printed circuit board manufacturing. This red rigid cushion press pad effectively replaces hot press kraft paper, significantly improving dimensional safety and stability in rigid PCB production. It features outstanding lamination performance and high stability, greatly enhancing yield and efficiency in the PCB production process.
Product Features
  • Reusable for 300-500 lamination cycles, significantly reducing PCB production costs
  • Superior performance in flatness, wear resistance, size increase ratio, and thickness variation compared to hot press kraft paper
  • Excellent high temperature resistance, operating continuously at up to 280℃ without carbonization or brittleness
  • Outstanding buffering effect and thermal conductivity with stable compression increase and expansion coefficient
  • Good tear resistance with flame retardant, non-toxic, odorless, dust-free, and shavings-free properties
  • Excellent breathability for optimal performance
Product Structure
Rigid PCB cushion pads are available in two configurations based on their positioning in the lamination stack. Top and bottom cushion pads are positioned at the extremities of the PCB lamination sheet package, while middle layer cushion pads are used between PCB layers. Middle layer pads typically measure 1.5-2.0mm thick, while top and bottom pads range from 4.0mm to 6.5mm in thickness.
These cushion pads (also known as press pads, cushion mats, buffering pads, or hot press cushions) are ideal for physical buffering operations in middle layers and manual operations requiring multiple sheet replacements. They are equally suitable for automated PCB laminating operations, replacing multiple sheets of hot press kraft paper with a single pad, reducing production material costs by at least 20%.
Layer Composition
  • Nano high temperature resistant coating
  • Fiberglass cloth
  • High molecular weight polymer
  • Tensile tear layer
  • Polymer aggregates
  • Fiberglass cloth
  • Nano high temperature resistant coating
Technical Parameters
Parameter Specification
Service Life 300-500 cycles
High Temperature Resistance ≤280℃
Thickness (Top/Bottom Pad) 4mm-6.5mm
Thickness (Middle Layer Pad) 1.5-2.0mm
Thickness Tolerance ±0.3mm
Standard Sizes (L*W) 1500*1300mm, 1300*780mm, 1170*690mm, 1160*665mm, 1180*660mm, 1295*788mm, 27.5"*24", 45"*51", 59"*51"
Size Tolerance ±2mm
Tensile Strength ≥ 25 MPa
Buffer Standard ≥ 12%
Water Absorption Standard < 8% (3-8%)
Applications
Also known as PCB lamination cushion press pad, PCB cushion mat, PCB buffering pad, or PCB hot press pad, this product serves as essential cushioning and buffering material for completing the PCB printed circuit board lamination process. It is a critical component in ensuring high-quality PCB manufacturing with improved efficiency and reduced material costs.
Rigid PCB Cushion Pad MKCP-PCB-G2 product demonstration PCB cushion pad technical specifications and application

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