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Rigid PCB Hot Press Cushion Laminated Pad With High Temperature Resistant & Reusable Lamination Buffer Pad
Product Details:
| Place of Origin: | China |
| Brand Name: | MK |
| Model Number: | MKCP-PCB-G2 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 50pcs |
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| Price: | Negotiable |
| Packaging Details: | Strong plywood package with proper soft protection material inside, suitable for long distance for sea or air transport |
| Delivery Time: | 10-20 working days |
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union |
| Supply Ability: | 10000 Square Meters per Month |
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Detail Information |
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| Reusable Times: | 300–500 Repeated Lamination & Pressing Cycles | Feature: | Long-term Stable Operation Under ≤280℃ |
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| Performance: | Compression And Expansion Coefficient | Physical Properties: | High Flatness, Wear Resistance And Tear Resistance, Stable Thickness Variation Rate |
| Thickness Tolerance: | ±0.3mm | Water Absorption: | 3%–8% |
| Highlight: | Rigid PCB laminated pad,High temperature resistant lamination buffer pad,Reusable PCB hot press cushion |
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Product Description
Rigid PCB Hot Press Cushion Laminated Pad
High-performance red rigid buffer pad designed for rigid PCB hot lamination processes, featuring high temperature resistance and reusability.
Product Overview
MKCP-PCB-G2 Rigid PCB Cushion Pad is engineered to replace traditional hot-press kraft paper, delivering superior dimensional stability, uniform heat conduction, and consistent cushioning effect. Suitable for both manual and automatic PCB lamination production lines, this reusable pad significantly improves PCB lamination yield and production efficiency while reducing comprehensive material costs by over 20%.
Application Specifications
- Top & Bottom Cushion Pad: 4.0-6.5mm thickness for outermost layers of lamination stacks
- Middle Layer Cushion Pad: 1.5-2.0mm thickness for uniform intermediate buffering between PCB layers
Key Features & Benefits
- 300-500 repeated lamination cycles for significant production cost reduction
- Superior performance in flatness, wear resistance, and dimensional stability compared to kraft paper
- High temperature resistance up to 280℃ without carbonization or brittleness
- Excellent buffering effect and thermal conductivity with stable compression and expansion coefficients
- Flame retardant, non-toxic, odorless, dust-free with good breathability
Product Structure
Multi-layer construction includes: Nano high temperature resistant coating, fiberglass cloth, high molecular weight polymer, tensile tear layer, polymer aggregates, and additional fiberglass cloth with protective coating.
Performance Specifications
| Core Item | Product Performance & Features |
|---|---|
| Reusable Times | 300-500 repeated lamination & pressing cycles, ultra-low consumption cost |
| High Temperature Resistance | Long-term stable operation under ≤280℃, no carbonization or brittleness |
| Buffering & Thermal Performance | Excellent cushioning & thermal conductivity, stable compression and expansion coefficient |
| Physical Properties | High flatness, wear resistance and tear resistance, stable thickness variation rate |
| Safety & Environmental Protection | Flame retardant, non-toxic, odorless, dust-free and breathable |
| Cost Advantage | Single pad replaces multiple kraft paper layers, saving over 20% production cost |
Technical Parameters
- Service life: 300-500 cycles
- High temperature resistance: ≤280℃
- Thickness: 4mm-6.5mm (top/bottom pad) / 1.5-2.0mm (middle layer pad)
- Thickness tolerance: ±0.3mm
- Standard sizes: 1500×1300mm, 1300×780mm, 1170×690mm, and various inch dimensions
- Size tolerance: ±2mm
- Tensile strength: ≥ 25 MPa
- Buffer standard: ≥ 12%
- Water absorption: < 8% (3-8%)
Compared with traditional hot-press kraft paper, MKCP-PCB-G2 cushion pad achieves more stable lamination quality, lower replacement frequency and higher production efficiency, making it essential for standardized and high-precision rigid PCB lamination production.
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