 |
German/Japan Raw Material ≥450HRC Hardness 1.0-2.0mm Thick Printed Circuit Board PCB/CCL Thin Press Plate MKSP-S301
Product Details:
| Place of Origin: | China |
| Brand Name: | MK |
| Model Number: | MKSP-S301 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 10pcs |
|---|---|
| Price: | negotiable |
| Packaging Details: | export package |
| Delivery Time: | 15days after getting the prepayment |
| Payment Terms: | Western Union,T/T,D/P,D/A,L/C |
|
Detail Information |
|||
| Steel Material: | German Or Japan Raw MaterialSUS301H | Normal Thickness (mm):: | 0.5,1.0, 1.2mm |
|---|---|---|---|
| Hardness: | ≥450HRC | Thickness Tolerance: | ±0.10 |
| Normal Sizes Of Copper Clad Laminate CCL Lamination Steel Plate/press Plate (L * W In Mm):: | 1910*1270/2210*1270/2220*1270. | Normal Sizes Of PCB Lamination Steel Plate/press Plate (L*W In Mm):: | 1500*1295/1300*800/1295*787/ 1295*1613/1295*1143/1295*787/ 1285*750/1280*1120/1280*1070/1280*970/ 1270*1118/1270*1070/1143*660/673*571/660*508/24"*28". |
| Average Thermal Expansion Coefficient (10-6/℃): | 17 | Surface Finish: | Ra≤0.14um/Rz≤1.50um |
| Highlight: | German/Japan PCB press plate 450HRC hardness,1.0-2.0mm thick CCL laminated steel plate,MKSP-S301 thin press plate with warranty |
||
Product Description
German/Japan Raw Material ≥450HRC Hardness 1.0-2.0mm Thick Printed Circuit Board PCB/CCL Thin Press Plate MKSP-S301
PCB/CCL Thin Press Plate MKSP-S301 features thin sheet thickness using high-quality Japanese or German raw material steel (SUS301H model), offering competitive pricing with reliable quality performance.
Product Specifications
| Steel Material | SUS301H |
| Normal Thickness (mm) | 0.5, 1.0, 1.2 |
| PCB Lamination Plate Sizes (L*W mm) | 1500*1295, 1300*800, 1295*787, 1295*1613, 1295*1143, 1295*787, 1285*750, 1280*1120, 1280*1070, 1280*970, 1270*1118, 1270*1070, 1143*660, 673*571, 660*508, 24"*28" |
| CCL Lamination Plate Sizes (L*W mm) | 1910*1270, 2210*1270, 2220*1270 |
Technical Parameters
- Steel material: SUS301H
- Normal thickness (mm): 0.5, 1.0, 1.2
- Hardness: ≥450HRC
- Work temperature: ≤280℃
Performance Specifications
| Parameter | Mass-Lam Plate | Pin-Lam Plate |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Width | ≤1300 | ≤1300 |
| Length | ≤2410 | ≤2410 |
| Thickness Tolerance | ±0.10 | ±0.10 |
| Surface Roughness (um) | Ra≤0.15 Rz≤1.5 | Ra≤0.15 Rz≤1.5 |
| Warpage Degree | ≤3mm/M | ≤3mm/M |
| L/W Size Tolerance | ±1mm | ±1mm |
| Hardness HRC | ≥450HRC | ≥450HRC |
| Work Temperature | ≤280℃ | ≤280℃ |
| Parallelism | ≤0.03 | ≤0.03 |
| Thermal Conductivity | 15W/MK | 15W/MK at 300℃ |
| Average Thermal Expansion Coefficient (10-6/℃) | 17 | 17 |
| Surface Finish | Ra≤0.14um/Rz≤1.50um | Ra≤0.14um/Rz≤1.50um |
Key Features
- Competitive pricing advantage with reliable lamination performance
- Superior thermal conductivity and thermal expansion coefficient
- Solves copper plate wrinkling problems
- Compatible with various lamination steel plate washing machines
Applications
Using thinner press plates increases laminated layer capacity for enhanced productivity. This reduces temperature differentials between layers in the laminator, improving heating and cooling efficiency.
Want to Know more details about this product