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CCL Lamination Steel Plate Japanese High-Precision NAS Alloy Steel Plate for Copper Clad Laminate Hot Pressing
Product Details:
| Place of Origin: | China |
| Brand Name: | MK |
| Model Number: | MKSP-CCL-400 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 50pcs |
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| Price: | Negotiable |
| Packaging Details: | Strong plywood package with proper soft protection material inside, suitable for long distance for sea or air transport |
| Delivery Time: | 10-20 working days |
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union |
| Supply Ability: | 10000 Square Meters per Month |
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Detail Information |
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| Main Steel Grade: | Japanese NAS630 (preferred), NAS301 | Conventional Thickness: | 1.5mm / 1.6mm / 1.8mm / 2.0mm |
|---|---|---|---|
| Service Life: | 8–10 Years Of Long-term Reusable Service | Standard Sizes (L*W Mm): | 2220*1270, 2210*1270, 1910*1270, 1500*1295, 1300*800, 1295*787 Etc |
| Product Name: | CCL Lamination Steel Plate | Thickness Range: | 1.0–2.5mm |
| Highlight: | Japanese high-precision NAS alloy steel plate,CCL lamination steel plate for hot pressing,copper clad laminate steel plate |
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Product Description
CCL Lamination Steel Plate - Japanese High-Precision NAS Alloy Steel
Premium lamination steel plate specifically engineered for Copper Clad Laminate (CCL) hot pressing production, featuring exceptional precision and durability.
Product Overview
MKSP-CCL-400 is a mature, high-precision lamination steel plate exclusively designed for Copper Clad Laminate (CCL) hot pressing production. With years of specialization in CCL and PCB lamination auxiliary materials, we provide premium-grade lamination steel plates that fully meet the stringent high-temperature pressing requirements of large-size CCL boards.
This series adopts imported Japanese NAS metallurgical raw materials, mainly NAS630 and NAS301 high expansion coefficient precipitation hardening steel. Supported by advanced heat treatment and precision grinding technology, the steel plate features ultra-high hardness, ultra-low surface roughness and excellent thermal conductivity.
Universally compatible with mainstream CCL laminators including BURKLE, LAUFFER, CEDAL, HELD, DATIAN, WEIDI and DIPUER. Widely known as CCL laminated plate, pressing steel plate, partition plate and mirror steel plate, it is a core precision auxiliary material for high-quality CCL manufacturing.
What is Copper Clad Laminate (CCL)?
Copper Clad Laminate (CCL) is a composite substrate made of resin-impregnated electronic fiberglass cloth with single or double-sided copper foil through high-temperature hot pressing. As the base material of all PCB products, it determines the circuit signal transmission speed, insulation performance, processing stability and long-term reliability of finished printed circuit boards.
Basic Specifications & Service Life
- Main Steel Grade: Japanese NAS630 (preferred), NAS301
- Conventional Thickness: 1.5mm / 1.6mm / 1.8mm / 2.0mm
- Service Life: 8-10 years of long-term reusable service
- Usage Reminder: Replace when thickness is below 1.3mm; plates of 1.3-1.6mm thickness must maintain zero deformation, zero warpage and standard hardness
Standard Sizes (L*W mm)
2220*1270, 2210*1270, 1910*1270, 1500*1295, 1300*800, 1295*787, 1295*1613, 1295*1143
Core Product Advantages
| Performance Item | Product Advantages |
|---|---|
| Premium Raw Material | Adopts top-tier Japanese NAS630/NAS301 steel raw materials, with mature heat treatment and precision grinding craftsmanship for stable lamination performance |
| Ultra-Low Deformation | Minimal warpage under continuous high-temperature pressing, ensuring flat and uniform CCL board surface |
| Excellent Thermal Performance | Optimized thermal conductivity and stable thermal expansion coefficient, realizing consistent heat transfer during lamination |
| High Durability & Hardness | Superior corrosion resistance and high structural hardness, supporting long-cycle industrial production |
| Strong Compatibility | Fully adaptable to all types of industrial steel plate washing machines and mainstream CCL hot press equipment |
Full Performance Parameter Comparison
| Technical Item | NAS630 Mass-Lam Plate | NAS630 Pin-Lam Plate | NAS301 Mass-Lam Plate | NAS301 Pin-Lam Plate |
|---|---|---|---|---|
| Thickness Range | 1.0-2.5mm | 1.0-2.5mm | 1.0-1.8mm | 1.0-1.8mm |
| Max Width | ≤1300mm | ≤1300mm | ≤1060mm | ≤1060mm |
| Max Length | ≤2410mm | ≤2410mm | ≤3150mm | ≤3150mm |
| Thickness Tolerance | ±0.05mm | ±0.05mm | ±0.05mm | ±0.05mm |
| Surface Roughness | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm |
| Positioning Hole Tolerance | -- | +0.1/-0mm | -- | +0.1/-0mm |
| Bushing Slot Tolerance | -- | +0.05/-0mm | -- | +0.05/-0mm |
| Warpage Degree | ≤3mm/M | ≤3mm/M | ≤3mm/M | ≤3mm/M |
| L&W Size Tolerance | ±1mm | ±1mm | ±1mm | ±1mm |
| Yield Strength | ≥1175 N/mm² | ≥1175 N/mm² | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile Strength | ≥1400 N/mm² | ≥1400 N/mm² | ≥520 N/mm² | ≥520 N/mm² |
| Extensibility | ≥5% | ≥5% | ≥5% | ≥5% |
| Hardness (HRC) | 50±2 HRC | 50±2 HRC | 44±2 HRC | 44±2 HRC |
| Max Working Temperature | ≤400℃ | ≤400℃ | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03mm | ≤0.03mm | ≤0.03mm | ≤0.03mm |
| Diagonal Deviation | 1mm | 1mm | 1mm | 1mm |
| Thermal Conductivity @300℃ | ≥25 W/MK | ≥25 W/MK | ≥18 W/MK | ≥18 W/MK |
| Average Thermal Expansion Coefficient | 10~12 ×10⁻⁶/℃ | 10~12 ×10⁻⁶/℃ | 15~17 ×10⁻⁶/℃ | 15~17 ×10⁻⁶/℃ |
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