PCB Lamination Steel Plate Japanese High-Precision NAS Alloy Steel Plate for Printed Circuit Board Hot Pressing
Product Details:
| Place of Origin: | China |
| Brand Name: | MK |
| Model Number: | MKSP-PCB-400 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 50pcs |
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| Price: | Negotiable |
| Packaging Details: | Strong plywood package with proper soft protection material inside, suitable for long distance for sea or air transport |
| Delivery Time: | 10-20 working days |
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union |
| Supply Ability: | 10000 Square Meters per Month |
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Detail Information |
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| Main Steel Grade: | Japanese NAS630 (preferred), NAS301 | Surface Roughness: | Ra≤0.15μm, Rz≤1.5μm |
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| Service Extensibility: | ≥5% | Standard Sizes (L*W Mm): | 1500*1295, 1300*800, 1295*787, 1295*1613, 1295*1143, 1285*750, 1280*1120mm Etc |
| Item Name: | PCB Lamination Steel Plate | Max Working Temperature: | 1.0–≤400℃ |
| Highlight: | PCB lamination steel plate,Japanese high-precision NAS alloy steel plate,printed circuit board hot pressing plate |
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Product Description
PCB Lamination Steel Plate - Japanese High-Precision NAS Alloy Steel
Professional high-precision lamination steel plate specifically developed for Printed Circuit Board (PCB) hot pressing and lamination processes, engineered to meet ultra-strict industrial manufacturing standards.
Product Overview
MKSP-PCB-400 is a mature and reliable high-precision lamination steel plate professionally developed for Printed Circuit Board (PCB) hot pressing and lamination processes. With years of deep engagement in the PCB and CCL lamination auxiliary material industry, we specialize in supplying high-precision lamination and partition steel plates that fully satisfy the ultra-strict pressing standards of industrial PCB manufacturing.
This product series adopts imported Japanese NAS metallurgical raw materials, including high expansion coefficient precipitation hardening steel NAS630 and NAS301 (NAS630 is the preferred grade). Combined with advanced industrial heat treatment and ultra-precision grinding technology, the steel plate delivers ultra-high hardness, ultra-low surface roughness and stable thermal conductivity.
Universally compatible with mainstream PCB laminator brands such as BURKLE, LAUFFER, CEDAL, HELD, DATIAN, WEIDI and DIPUER, it is widely recognized as PCB laminated plate, pressing steel plate, partition plate and mirror steel plate, serving as a core precision consumable for high-yield and high-quality PCB production worldwide.
What is PCB?
A Printed Circuit Board (PCB) is a fundamental and indispensable component in the global electronics industry. By patterning conductive copper foil on insulating substrates, it provides stable mechanical support and precise electrical interconnection for electronic components, covering nearly all consumer, industrial and automotive electronic devices. The flatness, thermal stability and pressing uniformity of PCB lamination steel plates directly determine the finished PCB quality, circuit stability and production consistency.
Basic Specifications & Service Life
Main Steel Grade: Japanese NAS630 (preferred), NAS301
Conventional Thickness: 1.5mm / 1.6mm / 1.8mm / 2.0mm
Service Life: 8-10 years of long-term reusable service
Usage Reminder: Replace when thickness is below 1.3mm; plates of 1.3-1.6mm thickness must maintain zero deformation, zero warpage and standard hardness
Standard Sizes (L*W mm)
2220*1270, 2210*1270, 1910*1270, 1500*1295, 1300*800, 1295*787, 1295*1613, 1295*1143
Core Product Advantages
| Performance Item | Product Advantages |
|---|---|
| Premium Japanese Raw Material | Adopts top-grade imported Japanese NAS630/NAS301 steel, manufactured via advanced heat treatment and precision grinding processes to ensure stable and consistent lamination performance in mass PCB production. |
| Ultra-Low High-Temp Warpage | Minimal deformation and warpage under continuous high-temperature pressing cycles, maintaining perfect flatness for finished PCB boards and greatly improving product yield. |
| Superior Thermal Performance | Features optimized thermal conductivity and stable thermal expansion coefficient, realizing uniform heat distribution and balanced pressure transmission during PCB lamination. |
| High Hardness & Corrosion Resistance | Excellent structural hardness and corrosion resistance, adapting to long-term repeated industrial pressing and extending overall service life. |
| Strong Equipment Compatibility | Fully compatible with all types of industrial steel plate washing machines and mainstream PCB hot press equipment for smooth mass production operation. |
Full Performance Parameter Comparison (NAS630 / NAS301)
| Technical Item | NAS630 Mass-Lam Plate | NAS630 Pin-Lam Plate | NAS301 Mass-Lam Plate | NAS301 Pin-Lam Plate |
|---|---|---|---|---|
| Thickness Range | 1.0-2.5mm | 1.0-2.5mm | 1.0-1.8mm | 1.0-1.8mm |
| Max Width | ≤1300mm | ≤1300mm | ≤1060mm | ≤1060mm |
| Max Length | ≤2410mm | ≤2410mm | ≤3150mm | ≤3150mm |
| Thickness Tolerance | ±0.05mm | ±0.05mm | ±0.05mm | ±0.05mm |
| Surface Roughness | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm |
| Positioning Hole Tolerance | -- | +0.1/-0mm | -- | +0.1/-0mm |
| Bushing Slot Tolerance | -- | +0.05/-0mm | -- | +0.05/-0mm |
| Warpage Degree | ≤3mm/M | ≤3mm/M | ≤3mm/M | ≤3mm/M |
| L&W Size Tolerance | ±1mm | ±1mm | ±1mm | ±1mm |
| Yield Strength | ≥1175 N/mm² | ≥1175 N/mm² | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile Strength | ≥1400 N/mm² | ≥1400 N/mm² | ≥520 N/mm² | ≥520 N/mm² |
| Extensibility | ≥5% | ≥5% | ≥5% | ≥5% |
| Hardness (HRC) | 50±2 HRC | 50±2 HRC | 44±2 HRC | 44±2 HRC |
| Max Working Temperature | ≤400℃ | ≤400℃ | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03mm | ≤0.03mm | ≤0.03mm | ≤0.03mm |
| Diagonal Deviation | 1mm | 1mm | 1mm | 1mm |
| Thermal Conductivity @300℃ | ≥25 W/MK | ≥25 W/MK | ≥18 W/MK | ≥18 W/MK |
| Average Thermal Expansion Coefficient | 10~12 ×10⁻⁶/℃ | 10~12 ×10⁻⁶/℃ | 15~17 ×10⁻⁶/℃ | 15~17 ×10⁻⁶/℃ |
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